Although the as sprayed CS-Cu was the least corrosion resistant, the corrosion rate of the heat-treated CS-Cu was similar to that of the ED-Cu and wrought Cu (SKB-Cu). The corrosion rate was examined by corrosion potential (E CORR) and polarization resistance (R p) measurements on Cu specimens in solutions containing 0.1 M NaCl + 1 × 10 −3 M Na 2S. R-release (arm64): RMTL_0.9.9.tgz, r-oldrel (arm64): RMTL_0.9.9.tgz, r-release (x86_64): RMTL_0.9.9.tgz, r-oldrel (x86_64): RMTL_0.9.9.The microstructures of copper (Cu) materials were investigated by electron backscatter diffraction, showing that electrodeposited (ED) Cu has a homogenous polycrystalline microstructure, while cold spray (CS) Cu has a heterogeneous microstructure with varying grain size, pores, and interfacial splat regions.

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